MediaTek, a leading semiconductor company, has announced the launch of the Dimensity 7300 and Dimensity 7300X, two ultra-efficient 4nm chips designed for high-tech mobile devices,
MediaTek has announced the release of its latest flagship mobile chip, the Dimensity 9300+. This new System-on-Chip (SoC) is designed to enhance the performance of
At MWC 2024, MediaTek has announced the T300 which is the is the latest addition to their 5G RedCap range, designed for wearables and IoT
MediaTek has announced it will be showcasing on-device generative AI using Llama 2, Meta’s open-source large language model (LLM), at next week’s Mobile World Congress
At CES 2024, MediaTek, a leading fabless semiconductor company, has announced a new collaboration with Google to develop a multi-radio chipset solution supporting Thread, Wi-Fi,
MediaTek has unveiled its latest chipset, the Dimensity 8300, designed to enhance the premium 5G smartphone experience significantly. This new chipset is a testament to
MediaTek has expanded its Wi-Fi 7 portfolio with the introduction of its new Filogic 860 and Filogic 360 chipsets. This launch marks a significant step
MediaTek has unveiled a new era in 5G technology with its introduction of the RedCap solutions, including the world’s first Modem-RF System-On-Chip (SoC) for 5G
With the MediaTek Executive Summit upon us, this post aims to cover the history of Mediatek and their rise to become a key player in
MediaTek has announced its newest flagship mobile chipset, the Dimensity 9300, which the company claims delivers performance that beats Qualcomm’s recently announced Snapdragon 8 Gen