So, the Realme X7 series is turning out to be quite a newsworthy launch.

The new series of phones will launch in China on the 1^st of September; there is currently no word on global availability, and with them using MediaTek Dimensity chipsets it remains unclear if they will make it beyond China.

Recently the rear design of the phone was revealed, which has brought mixed reactions. Minimalist design is clearly out of the window now, and Realme is going all-in with branding.

In my opinion, the design looks very similar to some of the leaked designs of the Honor X10, but the released version was less in your face with the branding.

Confirmed specs

So far the only thing confirmed is that the Realme X7 Pro will have a 120 Hz OLED display with a single punch-hole to the top right of the display and a peak brightness of 1200nits. We also know that there will be at least two phones, the X7 and X70 Pro.

Realme X7 Pro will likely have the MediaTek Dimensity 1000+

The Realme RMX2121 – which is expected to be the Realme X7 Pro – has done a round of Geekbench testing and the benchmark shows that it’s powered by the MediaTek Dimensity 1000+ chipset.

This chipset offers a similar level of performance as the Qualcomm Snapdragon 865 (not plus) but at a more affordable price point.

The Dimensity 1000+ has a specification of:

• CPU
  • 4x Cortex A77 @ 2.6GHz
  • 4x Cortex A55 @ 2.0GHz
• GPU – Mali-G77MP9

It is believed the phone will have 6GB for the base model, but the model tested in Geekbench had 8GB. It then features a relatively generic camera set up with 64MP primary, 8MP wide then 2MP macro and 2MP depth.

The phone will have a 4,500mAh battery and it si believed to have 65W charging, but it could be the recently announced 120W.

This specification places it directly against the recently launched Redmi K30 Ultra.

Realme X7 probably has the MediaTek Dimensity 800U but maybe Dimensity 720

Current leaks and rumours seem to be mixed about what chipset will be used on the cheaper X7. Mediatek recently announced the Dimensity 800U and no company has launched a phone with this yet, so I am still pinning my hopes on this being featured on the X7.

Serial leaker Digital Chat Station also revealed a Geekbench listing which indicates the phone will use the Dimensity 800U

The Dimensity 800U has:

• CPU
  • 2x Cortex A76 @ 2.4GHz
  • 6x Cortex A55 @ 2.0GHz
• GPU – Mali-G57 MC3

Realme X7 Pro Player with Qualcomm Snapdragon 860

To throw a curve ball, the latest leak indicates another phone which will use an unannounced Qualcomm Snapdragon 860. This chipset has been mentioned a couple of times in the past but nothing solid has been revealed about it in the past.

As the name suggests, this will likely be a cut-down version of the Snapdragon 865, likely an attempt by Qualcomm to offer a more affordable high-end chipset to compete with Mediateks growing lineup of Dimensity chips.

We don’t know anything about this chipset yet, but I would expect a lower clocked version of the existing SD865. The current specification of that is:

• CPU (but with Kryo branding)

• 1x Arm Cortex A77 @ 2.84GHz
• 3x Arm Cortex A77 @ 2.42GHz
• 4x Arm Cortex A55@ 1.80GHz
• Adreno 650

With this being a player edition, this will hopefully offer more performance than the MediaTek Dimensity 1000+ of the Pro edition.

Realme have released Player Editions previously. The Realme X50 Pro Player is effectively the same as the Realme X50 Pro but with its camera specification cut back to allow the phone to be more affordable, however, it used the same Snapdragon 865 chipset.

Mediatek Dimensity 720 vs Dimensity 1000u vs Qualcomm Snapdragon 860 Specification Comparison Table